Découvrez les nouveaux modules Digi ConnectCore et xBee

Vous auriez pu rencontrer Digi au salon Embedded 2016 à Nuremberg en Allemagne du 23 au 25 février. Un représentant de Miel, spécialiste de Digi était également sur place pour vous recevoir et discuter des avancées technologiques en matière de modules embarqués pour la connexion des équipements.

Miel et Digi étaient sur le stand 449, Hall 5. En plus de plusieurs démonstrations présentant les produits Digi, incluant le MetroCab de Frazer-Nash (UK) et le NavNet TZtouch2 de Furuno, de nouvelles solutions comme les modules XBee ZigBee S2C/D et ConnectCore pour i.MX6UL.

Mises à jour majeures (en anglais)

Passons la parole à Digi qui mettais en avant les nouveautés de ses lignes de modules embarqués :

Major XBee Updates

We will highlight our industry-leading line of embedded RF modules, including:

• 802.15.4 /DigiMesh2.4 product family update that features major power improvements, OTA updatability, and now available in both through-hole and surface-mount (SMT) form factors
• Thread Ready module for simple IPv6 Mesh networking migration
• ZigBee 3.0 for broader interoperability
• New kits and development tools

Click here for more on the XBee family.

ConnectCore for i.MX6UL
The upcoming ConnectCore for i.MX6UL module delivers a secure and extremely cost-effective connected System-on-Module platform that is slightly bigger than a postage stamp. Based on NXP's new i.MX6UL application processor, its complete Linux software framework integrates device security and provides you with a fully integrated, long-term solution for your connected devices. 

• Secure, connected, highly cost-effective system-on-module 
  • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
  • Up to 2 GB NAND flash, up to 1 GB DDR3
• Stamp-sized and flexible Digi SMTplus™ form factor
• Dual Ethernet and pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 option
• Unique ultra-low power and wake-up state management
• Industrial operating temp and long-term availability

ConnectCore 6
The Digi ConnectCore 6 is a connected system-on-module platform based on the NXP i.MX6 processor family. The low-profile surface-mount design maximizes integration flexibility and significantly reduces design risk in a cost- effective, reliable form factor with highly optimized thermal performance even in the most demanding system configurations.

• Scalable NXP i.MX6 multi-core performance
• Extremely reliable, cost-effective, low-profile surface-mount form factor
• Gigabit Ethernet and pre-certified 802.11a/b/g/n and Bluetooth 4.0
• Optimized thermal design for industrial applications
• Long-term availability and complete software support

Click here for more on the ConnectCore family

Contactez Miel au 01 60 19 34 52 pour tout complément d'information.